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Package Mechanical Specifications
36 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
3.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal/Mechanical
Design Guidelines.
- Dual-Core Intel 1
- Processor 1
- Contents 3
- 1, 2, 3, 4 6
- Revision History 7
- 3000 Series Features 8
- 1 Introduction 9
- 1.1.1 Processor Terminology 10
- 1.2 References 11
- 1, 2, 5 12
- 2 Electrical Specifications 13
- 2.3 Voltage Identification 14
- Electrical Specifications 17
- Table 2-5. V 19
- Figure 2-1. V 20
- Table 2-6. V 20
- (Sheet 1 of 2) 20
- (Sheet 2 of 2) 21
- Figure 2-2. V 21
- Overshoot 22
- 2.6.4 Die Voltage Validation 22
- 2.7 Signaling Specifications 23
- 2.7.4 Clock Specifications 27
- 2.8 PECI DC Specifications 31
- Table 2-3 for V 32
- 3 Package Mechanical 33
- 3.2 Processor Markings 39
- INTEL ©'05 3065 40
- INTEL® XEON® 40
- SLxxx [COO] 40
- 2.33GHZ/4M/1333/06 40
- Preliminary 41
- Socket 775 41
- Quadrants 41
- Top View 41
- 4 Land Listing and Signal 43
- Descriptions 43
- Table 4-1. Alphabetical Land 46
- Assignments (Sheet 1 of 20) 46
- Assignments (Sheet 2 of 20) 46
- Assignments (Sheet 3 of 20) 47
- Assignments (Sheet 4 of 20) 47
- Assignments (Sheet 5 of 20) 48
- Assignments (Sheet 6 of 20) 48
- Assignments (Sheet 7 of 20) 49
- Assignments (Sheet 8 of 20) 49
- Assignments (Sheet 9 of 20) 50
- Assignments (Sheet 10 of 20) 50
- Assignments (Sheet 11 of 20) 51
- Assignments (Sheet 12 of 20) 51
- Assignments (Sheet 13 of 20) 52
- Assignments (Sheet 14 of 20) 52
- Assignments (Sheet 15 of 20) 53
- Assignments (Sheet 16 of 20) 53
- Assignments (Sheet 17 of 20) 54
- Assignments (Sheet 18 of 20) 54
- Assignments (Sheet 19 of 20) 55
- Assignments (Sheet 20 of 20) 55
- (Sheet 1 of 20) 56
- (Sheet 2 of 20) 56
- (Sheet 3 of 20) 57
- (Sheet 4 of 20) 57
- (Sheet 5 of 20) 58
- (Sheet 6 of 20) 58
- (Sheet 7 of 20) 59
- (Sheet 8 of 20) 59
- (Sheet 9 of 20) 60
- (Sheet 10 of 20) 60
- (Sheet 11 of 20) 61
- (Sheet 12 of 20) 61
- (Sheet 13 of 20) 62
- (Sheet 14 of 20) 62
- (Sheet 15 of 20) 63
- (Sheet 16 of 20) 63
- (Sheet 17 of 20) 64
- (Sheet 18 of 20) 64
- (Sheet 19 of 20) 65
- (Sheet 20 of 20) 65
- 5 Thermal Specifications and 73
- Design Considerations 73
- 5.1.2 Thermal Metrology 78
- 5.2.1 Thermal Monitor 78
- 5.2.2 Thermal Monitor 2 79
- 5.3 Thermal Diode 81
- PECI Host 84
- Controller 84
- Domain 0 84
- 5.4.2.1 PECI Device Address 86
- 5.4.2.2 PECI Command Support 86
- 6 Features 87
- 6.2.2.1 HALT Powerdown State 88
- 6.2.3.1 Stop Grant State 89
- Features 90
- 6.3 Enhanced Intel 91
- SpeedStep 91
- Technology 91
- 7.1 Mechanical Specifications 94
- 7.2 Electrical Requirements 95
- 7.3 Thermal Specifications 97
- 7.3.2 Variable Speed Fan 99
- 8 Debug Tools Specifications 101
- Debug Tools Specifications 102
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