Hp ProLiant BL620c G7 Server-Blade Manual de usuario Pagina 31
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Hardware options installation 31
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the
heatsink is removed from the processor after it has been installed.
IMPORTANT: Processor socket 1 must be populated at all times or the server blade does not
function.
To install the component:
1. Locate and download the latest ROM version from the HP website (http://www.hp.com/support).
Follow the instructions on the website to update the system ROM.
2. Power down the server blade (on page 14).
3. Remove the server blade (on page 15).
4. Remove the access panel (on page 16).
5. Remove the hard drives.
6. Remove the front panel/hard drive cage assembly (on page 19).
7. Remove the heatsink blank.
CAUTION: Failure to completely open the processor locking lever prevents the processor from
seating during installation, leading to hardware damage.
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- SAS and SATA hard drive LEDs 8
- System board components 9
- System maintenance switch 10
- Accessing the redundant ROM 11
- DIMM slot locations 12
- HP c-Class Blade SUV Cable 12
- Item Connector Description 13
- Operations 14
- Remove the server blade 15
- Remove the access panel 16
- Install the access panel 16
- Remove the left DIMM baffle 17
- Remove the right DIMM baffle 18
- Remove the battery pack 19
- Overview 21
- Remove the device bay blank 22
- Setup 23 23
- Setup 26 26
- Connecting to the network 27
- Installing a server blade 28
- Completing the configuration 29
- Introduction 30
- Processor option 30
- Memory option 36
- Dual- and quad-rank DIMMs 37
- DIMM identification 37
- DIMM installation guidelines 38
- Channel Slot Slot number 40
- Hemisphere mode 41
- Memory RAS 43
- HP Memory Quarantine 45
- Installing DIMMs 46
- Remove the hard drive blank 48
- Prepare the hard drive 48
- Mezzanine card option 49
- Controller options 51
- Installing a capacitor pack 53
- BitLocker™ enabled 57
- Additional TPM features 57
- Cabling 58
- Item Description 60
- Network-based PXE deployment 61
- Deployment overview 62
- Deployment infrastructure 62
- Deployment methods 63
- PXE deployment 64
- CD-ROM deployment 64
- Diskette image deployment 65
- SAN configuration 66
- Configuration tools 67
- HP ROM-Based Setup Utility 68
- Boot options 69
- BIOS Serial Console 69
- Configuring AMP modes 69
- Configuring mirrored memory 70
- Array Configuration Utility 71
- Management tools 72
- ROMPaq utility 73
- Erase Utility 73
- Redundant ROM support 74
- Diagnostic tools 75
- Keeping the system current 77
- Firmware 78
- HP Smart Update Manager 78
- Care Pack 79
- Troubleshooting 80
- Warnings 81
- Symbols on equipment 81
- Symptom information 82
- Troubleshooting 83 83
- Loose connections 84
- Service notifications 84
- Server health LEDs 84
- Troubleshooting flowcharts 84
- Start diagnosis flowchart 85
- General diagnosis flowchart 86
- Symptoms: 88
- POST problems flowchart 90
- OS boot problems flowchart 92
- • Corrupted OS 93
- • Redundancy failure 95
- (http://www.hp.com/support) 96
- Troubleshooting 97 97
- Battery replacement 98
- FCC rating label 99
- Class A equipment 99
- Class B equipment 99
- Modifications 100
- • EMC Directive 2004/108/EC 101
- Japanese notice 102
- BSMI notice 102
- Korean notice 102
- Battery replacement notice 103
- Chinese notice 103
- Laser compliance 103
- Wireless devices 104
- Japanese notices 105
- Taiwan notices 105
- Electrostatic discharge 106
- Specifications 107
- Technical support 108
- Technical support 109 109
- Customer Self Repair 110
- Technical support 111 111
- Reparo feito pelo cliente 112
- Technical support 113 113
- Technical support 114 114
- Technical support 115 115
- Acronyms and abbreviations 116
- Index 119 119
- Index 120 120
- Index 121 121
- Index 122 122
- Index 123 123
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