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Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45

Thermal/Mechanical Reference Design

Note: Intel has also developed an 1U alternative reference heatsink design. This

alternative heatsink design meets the thermal profile specifications of the

Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of

weight reduction and cost savings. Refer to Appendix B for detail information.

2.5.7 Components Overview

2.5.7.1 Heatsink with Captive Screws and Standoffs

The CEK reference heatsink uses snapped-fin technology for its design. It consists of a

copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The

mounting screws and standoffs are also made captive to the heatsink base for ease of

handling and assembly as shown in Figure 2-22 and Figure 2-23 for the 2U+ and 1U

heatsinks, respectively.

Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400

Series Thermal Profile

0510

20 25 30 35 40

60 65 70 75 80

Tcase (

)

CASE_MAX

@ TDP

1U CEK Reference Solution

Y = 0.246 * X + 40

Thermal Profile

Y = 0.298 * X + 43.2

1 2 ... 40 41 42 43 44 45 46 47 48 49 50 ... 99 100

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HP E5440 Especificaciones Pagina 45