HP E5440 Especificaciones descargar pdf (Pagina 91)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91

Quality and Reliability Requirements

E Quality and Reliability

Requirements

E.1 Intel Verification Criteria for the Reference

Designs

E.1.1 Reference Heatsink Thermal Verification

The Intel reference heatsinks will be verified within specific boundary conditions using a

TTV and the methodology described in the Intel

Xeon

Dual- and Multi- Processor

Family Thermal Test Vehicle User's Guide.

The test results, for a number of samples, are reported in terms of a worst-case mean

+ 3σ value for thermal characterization parameter using real processors (based on the

TTV correction offset).

E.1.2 Environmental Reliability Testing

E.1.2.1 Structural Reliability Testing

The Intel reference heatsinks will be tested in an assembled condition, along with the

LGA771 Socket. Details of the Environmental Requirements, and associated stress

tests, can be found in the LGA771 Socket Mechanical Design Guide.

The use condition environment definitions provided in Appendix E-1are based on

speculative use condition assumptions, and are provided as examples only.

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HP E5440 Especificaciones Pagina 91