HP Intel Xeon W3550 Especificaciones descargar pdf (Pagina 7)

Thermal/Mechanical Design Guide 7

Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions

for the:

• Intel® Xeon® Processor 3500 Series

Unless specifically required for clarity, this document will use “processor” in place of the

specific product names. The components described in this document include:

• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back

plate.

The goals of this document are:

• To assist board and system thermal mechanical designers.

• To assist designers and suppliers of processor heatsinks.

Thermal profiles and other processor specifications are provided in the appropriate

processor Datasheet.

Figure 1-1. Processor Thermal Solution & LGA1366 Socket Stack

1 2 3 4 5 6 7 8 9 10 11 12 ... 71 72

Sin comentarios

HP Intel Xeon W3550 Especificaciones Pagina 7