HP Intel Xeon W3550 Especificaciones descargar pdf (Pagina 9)

Thermal/Mechanical Design Guide 9

Introduction

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target

power level. TDP is not the maximum power that the processor can dissipate.

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has

reached its maximum operating temperature.

Thermal Profile Line that defines case temperature specification of the TTV at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink

and the processor case. This material fills the air gaps and voids, and enhances the

transfer of the heat from the processor case to the heatsink.

AMBIENT

The measured ambient temperature locally surrounding the processor. The ambient

temperature should be measured just upstream of a passive heatsink or at the fan inlet

for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is

usually measured at the chassis air inlets.

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

1 2 3 4 5 6 7 8 9 10 11 12 13 14 ... 71 72

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HP Intel Xeon W3550 Especificaciones Pagina 9