HP C3000 Manual de usuario

Busca en linea o descarga Manual de usuario para Servidores HP C3000. HP c3000 User's Manual Manual de usuario

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HP BladeSystem c3000 Enclosure technologies
technology brief
Abstract.............................................................................................................................................. 2
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2
HP Thermal Logic technologies .............................................................................................................. 4
Active Cool fans .............................................................................................................................. 5
HP PARSEC architecture.................................................................................................................... 6
Thermal Logic for the server blade and enclosure................................................................................. 7
Power supplies and enclosure power subsystem................................................................................... 8
HP BladeSystem Power Sizer ......................................................................................................... 9
Pooled power ............................................................................................................................ 10
Dynamic Power Saver mode ........................................................................................................ 11
Power Regulator......................................................................................................................... 11
Power Capping for each server blade........................................................................................... 11
Interconnect options and infrastructure.................................................................................................. 12
Fabric connectivity and port mapping............................................................................................... 13
Virtual Connect.............................................................................................................................. 16
Enclosure-based DVD ROM................................................................................................................. 17
Onboard Administrator ...................................................................................................................... 17
Insight Display ............................................................................................................................... 19
Web GUI...................................................................................................................................... 20
Command-line interface .................................................................................................................. 20
Onboard Administrator cabling ....................................................................................................... 20
Enclosure link cabling..................................................................................................................... 20
Recommendations.............................................................................................................................. 21
Summary .......................................................................................................................................... 21
Appendix A. Acronyms in text............................................................................................................. 22
Appendix B. Fan, power supply, and device bay population guidelines................................................... 23
For more information.......................................................................................................................... 28
Call to action .................................................................................................................................... 28
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Indice de contenidos

Pagina 1

HP BladeSystem c3000 Enclosure technologies technology brief Abstract...

Pagina 2 - Abstract

Values obtained from the BladeSystem Power Sizer tool are based on worst case loads and are intended for facility planning purposes only. Actual powe

Pagina 3

Connecting with no power redundancy configured If no power redundancy is configured, the total power available is defined as the power available fro

Pagina 4

server power consumption, checks it against the power cap goal, and, if necessary, adjusts server performance to maintain an average power consumptio

Pagina 5 - Active Cool fans

Figure 10. Traces on the signal midplane can transmit many different types of signals, depending on which interconnect fabrics are used. The right-h

Pagina 6 - HP PARSEC architecture

Figure 11. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purposes, it does not matter in which device bay a server

Pagina 7

interconnect. Depending on the configuration requirements, additional mezzanine cards and interconnects can be populated in: • Mezzanine 1 and Inter

Pagina 8

Figure 13 lists the available configurations for half-height devices installed in device bay N (1–8). Figure 13. Port mapping for HP BladeSystem c30

Pagina 9

Full details about Virtual Connect technology are available in the technology brief entitled “HP Virtual Connect technology implementation for the HP

Pagina 10

The Onboard Administrator aggregates up to eight iLO 2 ports in a c3000 Enclosure, simplifying cable management and providing a graphical interface t

Pagina 11

• Cooling—The Onboard Administrator makes sure there is sufficient cooling capacity for the server blade or interconnect module by retrieving therma

Pagina 12

Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack-mounted infrastructure. The c3000 Enclosure is

Pagina 13

More information about the Insight Display is available in the technology brief entitled “Managing the HP BladeSystem c-Class” at this URL: http://h1

Pagina 14

The enclosure link-down port connects to the enclosure link-up port on the enclosure below it. The enclosure link-up port connects to the enclosure l

Pagina 15

Appendix A. Acronyms in text The following acronyms are used in the text of this document. Table A-1. Acronyms Acronym Acronym expansion AC Alterna

Pagina 16 - Virtual Connect

Appendix B. Fan, power supply, and device bay population guidelines Figure B-1. HP BladeSystem c3000 Enclosure – Fan population guidelines. For corr

Pagina 17 - Onboard Administrator

Figure B-2. HP BladeSystem c3000 Enclosure – Power supply population guidelines Table B-1. Power supply placement Number of power supplies Power

Pagina 18

Figure B-3. HP BladeSystem c3000 Enclosure – Full-height server blade device bay numbering. Full--height servers should be populated from bottom to

Pagina 19 - Insight Display

Figure B-5. The c3000 Enclosure is divided by sheet metal panels into 2 full-height zones. Each horizontal zone is divided vertically by a removable

Pagina 20 - Enclosure link cabling

27 When installing a companion blade (HP StorageWorks SB40c Storage Blade, HP PCI Expansion Blade, or HP StorageWorks Ultrium 448c Tape Blade), the c

Pagina 21 - Recommendations

For more information For additional information, refer to the resources listed below. Resource description Web address General HP BladeSystem infor

Pagina 22 - Appendix A. Acronyms in text

Table 1. Comparison of components supported by HP BladeSystem c-Class Enclosures Enclosure c3000 c7000 Height 6U 10U Blade orientation Horizont

Pagina 23

Figure 2. HP BladeSystem c3000 Enclosure – rear view HP Thermal Logic technologies with a variety of HP Thermal Logic onnect er view : t Scalabl

Pagina 24 - AC redundancy options

Active Cool fans Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide localized cooling in the speci

Pagina 25

HP PARSEC architecture HP Parallel Redundant Scalable Enclosure Cooling (PARSEC) architecture is a hybrid model for cooling that combines the best of

Pagina 26

Figure 5. The c3000 Enclosure fan bay and device bay population guidelines Thermal Logic for the server blade and enclosure The server blade des

Pagina 27

Figure 6. Processor heat sink using fully ducted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Monit

Pagina 28 - Call to action

Figure 7. HP BladeSystem c3000 Enclosure supports up to six power supplies The new, high efficiency HP c3000 power supplies provide greater than 9

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