• Power Consumed—Current power consumed by the subsystem.
• Good Power Supplies—Number of power supplies that are currently operating in the subsystem.
• Wanted Power Supplies—Needed number of power supplies plus the redundant number of
power supplies in the subsystem.
• Needed Power Supplies—Number of power supplies needed for the subsystem to work properly.
Thermal Information
The Thermal Information table contains:
• Redundancy—Status of thermal subsystem redundancy: either in a redundant configuration,
not in a redundant configuration, or status unknown.
• Ambient Temperature—Temperature inside the enclosure.
• Good Fans—Number of fans currently operating in the enclosure.
• Wanted Fans—Needed number of fans plus the redundant number of fans.
• Needed Fans—Number of fans required for the subsystem not to overheat.
Fan Information
The Fan Information table contains, for each fan bay:
• Bay—Location of the fan.
• Status—Current status of the fan.
• Name—HP product name of the fan.
• Speed—Fan speed for thermal management of server.
• Power—Amount of power currently being consumed by the fan.
• Part Number—HP fan part number.
• Spare Part Number—HP fan spare part number.
Power Supplies
The Power Supplies table contains, for each power supply bay:
• Bay—Location of the power supply.
• Status—Current status of the power supply.
• Name—HP product name of the power supply.
• Power—Amount of power currently supplied and the total amount of power that can be
supplied.
• Serial Number—HP serial number for the power supply.
• Part Number—HP part number for the power supply.
• Spare Part Number—HP spare part number for the power supply.
Interconnect Trays
The Interconnect Trays table contains, for each interconnect tray:
• Bay—Bay number containing the interconnect tray.
• Status—Current status of the enclosure tray.
• Name—HP product name of the interconnect module.
• Power—Amount of power currently being used by the interconnect module.
• Serial Number—HP module serial number.
Enclosure 23
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