Hp ProLiant ML370 G6 Server Manual de usuario Pagina 168
- Pagina / 172
- Tabla de contenidos
- SOLUCIÓN DE PROBLEMAS
- MARCADORES
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Systems Insight Display LEDs 9
- Rear panel components 11
- Rear panel LEDs 12
- System board components 13
- DIMM slots 14
- System maintenance switch 14
- NMI functionality 15
- SAS and SATA device numbers 16
- SAS and SATA hard drive LEDs 17
- Battery pack LEDs 19
- FBWC module LEDs 20
- Operations 22
- Operations 23 23
- Operations 24 24
- Remove the access panel 25
- Remove fans 1-4 26
- Remove fan 5 26
- Remove the air baffle 28
- Remove the fan cage 29
- Remove the media bay blank 30
- Remove the DVD-ROM drive 31
- Operations 32 32
- Rack planning resources 33
- Optimum environment 34
- Power requirements 35
- Temperature requirements 35
- Rack warnings 36
- Server warnings and cautions 36
- Setup 37 37
- Installing hardware options 38
- Setting up a tower server 38
- Setup 39 39
- Registering the server 40
- Introduction 41
- Processor option 41
- Memory options 46
- DIMM identification 47
- Memory configurations 48
- Installing a DIMM 52
- Redundant fans option 53
- Power supply configuration 55
- Save the screws 60
- Install the drive cage 63
- Six-bay LFF backplane option 64
- Connect the power cable 66
- Expansion board options 78
- Storage controller option 84
- BBWC and FBWC options 84
- Installing the cache module 85
- HP SAS Expander Card option 87
- Graphics adapter option 88
- Rear (1) 92
- Front (2) 92
- Install the I/O bezel 97
- Cabling 103
- SAS hard drive cabling 104
- Item Description 105
- • Drive cage bay 1 106
- • Drive cage bay 2 106
- SAS expander cabling 108
- Media device data cabling 109
- DVD-ROM drive cabling 110
- Power cabling 111
- Front panel cabling 114
- Cabling 115 115
- Configuration tools 116
- Using RBSU 117
- Auto-configuration process 117
- Boot options 118
- BIOS Serial Console 118
- Configuring AMP modes 118
- Configuring mirrored memory 118
- Array Configuration Utility 119
- Management tools 121
- Erase Utility 122
- Redundant ROM support 122
- Diagnostic tools 123
- Integrated Management Log 124
- Keeping the system current 125
- Firmware 126
- HP Smart Update Manager 126
- Care Pack 127
- Troubleshooting 128
- Symbols on equipment 129
- Warnings and cautions 129
- Symptom information 130
- Loose connections 132
- Service notifications 133
- Server health LEDs 133
- Troubleshooting flowcharts 133
- General diagnosis flowchart 134
- Symptoms: 136
- Troubleshooting 138 138
- POST problems flowchart 139
- OS boot problems flowchart 141
- Troubleshooting 142 142
- • Redundancy failure 143
- (http://www.hp.com/support) 144
- Troubleshooting 145 145
- Battery replacement 146
- Battery replacement 147 147
- FCC rating label 148
- Class A equipment 148
- Class B equipment 148
- Modifications 149
- • EMC Directive 2004/108/EC 150
- Japanese notice 151
- BSMI notice 151
- Korean notice 151
- Chinese notice 152
- Laser compliance 152
- Battery replacement notice 152
- Electrostatic discharge 154
- Specifications 155
- Technical support 158
- Technical support 159 159
- Customer Self Repair 160
- Technical support 161 161
- Reparo feito pelo cliente 162
- Technical support 163 163
- Technical support 164 164
- Technical support 165 165
- Acronyms and abbreviations 166
- Index 169 169
- Index 170 170
- Index 171 171
- Index 172 172
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