Hp ProLiant ML370 G6 Server Manual de usuario Pagina 52
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Hardware options installation 52
• Observe the general DIMM slot population guidelines (on page 50).
• DIMM configuration on each channel of a processor must be identical.
• Each processor must have a valid Online Spare configuration.
• In multi-processor configurations, each processor can have a different valid Online Spare
configuration.
Installing a DIMM
CAUTION: To avoid damage to the hard drives, memory, and other system components, the air
baffle, drive blanks, and access panel must be installed when the server is powered up.
1. Power down the server (on page 22).
2. Do one of the following:
o Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).
o Extend the server from the rack (on page 24).
3. Remove the access panel (on page 25).
4. Remove fan 5 (on page 26).
5. If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).
6. Remove the air baffle (on page 28).
7. Open the DIMM slot latches.
8. Install the DIMM.
9. Install the air baffle.
10. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery
pack or the FBWC capacitor pack" on page 86).
11. Install fan 5.
12. Install the access panel.
If you are installing DIMMs in lock-step configuration, configure this mode in RBSU ("HP ROM-Based Setup
Utility" on page 116).
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Systems Insight Display LEDs 9
- Rear panel components 11
- Rear panel LEDs 12
- System board components 13
- DIMM slots 14
- System maintenance switch 14
- NMI functionality 15
- SAS and SATA device numbers 16
- SAS and SATA hard drive LEDs 17
- Battery pack LEDs 19
- FBWC module LEDs 20
- Operations 22
- Operations 23 23
- Operations 24 24
- Remove the access panel 25
- Remove fans 1-4 26
- Remove fan 5 26
- Remove the air baffle 28
- Remove the fan cage 29
- Remove the media bay blank 30
- Remove the DVD-ROM drive 31
- Operations 32 32
- Rack planning resources 33
- Optimum environment 34
- Power requirements 35
- Temperature requirements 35
- Rack warnings 36
- Server warnings and cautions 36
- Setup 37 37
- Installing hardware options 38
- Setting up a tower server 38
- Setup 39 39
- Registering the server 40
- Introduction 41
- Processor option 41
- Memory options 46
- DIMM identification 47
- Memory configurations 48
- Installing a DIMM 52
- Redundant fans option 53
- Power supply configuration 55
- Save the screws 60
- Install the drive cage 63
- Six-bay LFF backplane option 64
- Connect the power cable 66
- Expansion board options 78
- Storage controller option 84
- BBWC and FBWC options 84
- Installing the cache module 85
- HP SAS Expander Card option 87
- Graphics adapter option 88
- Rear (1) 92
- Front (2) 92
- Install the I/O bezel 97
- Cabling 103
- SAS hard drive cabling 104
- Item Description 105
- • Drive cage bay 1 106
- • Drive cage bay 2 106
- SAS expander cabling 108
- Media device data cabling 109
- DVD-ROM drive cabling 110
- Power cabling 111
- Front panel cabling 114
- Cabling 115 115
- Configuration tools 116
- Using RBSU 117
- Auto-configuration process 117
- Boot options 118
- BIOS Serial Console 118
- Configuring AMP modes 118
- Configuring mirrored memory 118
- Array Configuration Utility 119
- Management tools 121
- Erase Utility 122
- Redundant ROM support 122
- Diagnostic tools 123
- Integrated Management Log 124
- Keeping the system current 125
- Firmware 126
- HP Smart Update Manager 126
- Care Pack 127
- Troubleshooting 128
- Symbols on equipment 129
- Warnings and cautions 129
- Symptom information 130
- Loose connections 132
- Service notifications 133
- Server health LEDs 133
- Troubleshooting flowcharts 133
- General diagnosis flowchart 134
- Symptoms: 136
- Troubleshooting 138 138
- POST problems flowchart 139
- OS boot problems flowchart 141
- Troubleshooting 142 142
- • Redundancy failure 143
- (http://www.hp.com/support) 144
- Troubleshooting 145 145
- Battery replacement 146
- Battery replacement 147 147
- FCC rating label 148
- Class A equipment 148
- Class B equipment 148
- Modifications 149
- • EMC Directive 2004/108/EC 150
- Japanese notice 151
- BSMI notice 151
- Korean notice 151
- Chinese notice 152
- Laser compliance 152
- Battery replacement notice 152
- Electrostatic discharge 154
- Specifications 155
- Technical support 158
- Technical support 159 159
- Customer Self Repair 160
- Technical support 161 161
- Reparo feito pelo cliente 162
- Technical support 163 163
- Technical support 164 164
- Technical support 165 165
- Acronyms and abbreviations 166
- Index 169 169
- Index 170 170
- Index 171 171
- Index 172 172
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