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Hardware options installation 38
• Single-rank DIMM—One set of memory chips that is accessed while writing to or reading from the
memory.
• Dual-rank DIMM—Two single-rank DIMMs on the same module, with only one rank accessible at a time.
The server memory control subsystem selects the proper rank within the DIMM when writing to or reading
from the DIMM.
Dual-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current
DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4 GB.
Memory subsystem architecture
The memory subsystem in this node is divided into channels. Each processor supports four channels, and
each channel supports two DIMM slots.
Channel Slot Slot number
1
A
E
1
2
2
B
F
3
4
3
C
G
8
7
4
D
H
6
5
DIMM slots are identified by number and by letter. Letters identify the population order. Slot numbers are
reported by ROM messages during boot and are used for error reporting. For the DIMM slot locations, see
"DIMM slot locations ("DIMM slots" on page 12)."
Memory configurations
To optimize node availability, the node supports the following AMP modes:
• Advanced ECC—Provides the greatest memory capacity for a given DIMM size, while providing up to
4-bit error correction. This mode is the default option for this node.
• Mirrored Memory—Provides maximum protection against failed DIMMs. Uncorrectable errors in one
channel are corrected by the mirror channel.
• Lockstep—Provides enhanced protection while making all installed memory available to the operating
system. The node can continue to function if a single-bit or multi-bit memory failure within a single DRAM
device occurs.
AMP options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM
configuration, the node boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup
Utility (on page 75)."
For the latest memory configuration information, see the QuickSpecs on the HP website
(http://www.hp.com/go/qs).
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Component identification 6
- Item Description Status 7
- Node rear panel components 8
- • 1U node 10
- • 2U node 11
- System board components 12
- NMI functionality 13
- Drive bay numbering 14
- Operations 17
- Remove the 1U cable guard 18
- Install the 1U cable guard 19
- Remove the PCI riser cage 20
- Install the PCI riser cage 21
- Remove the Mini-SAS cable 23
- Connect the Mini-SAS cable 24
- Remove the 2U air baffle 26
- Install the 2U air baffle 26
- Remove the 1U air baffle 27
- Install the 1U air baffle 28
- Rack planning resources 29
- Configuring the chassis 29
- Installing hardware options 30
- Registering the server 31
- Introduction 32
- Processor option 32
- 13. Install the heatsink: 35
- Memory options 37
- Memory configurations 38
- Memory population guidelines 39
- Installing a DIMM 41
- Expansion board options 42
- GPU power cable option 43
- Controller options 54
- Cabling 59
- FBWC capacitor pack cabling 60
- 1U node configuration 61
- 2U node configuration 62
- GPU power cabling 63
- Mini-SAS P222 cabling 63
- Mini-SAS P420 LFF cabling 64
- Mini-SAS P420 SFF cabling 65
- Twelve SFF drives per node 66
- Six SFF drives per node 66
- Mini-SAS P430 cabling 67
- Mini-SAS P830 cabling 68
- Cabling 69 69
- Server mode 70
- HP product QuickSpecs 70
- HP iLO Management 70
- Active Health System 71
- Intelligent Provisioning 72
- Erase Utility 73
- HP Service Pack for ProLiant 74
- HP ROM-Based Setup Utility 75
- Boot options 76
- Configuring AMP modes 76
- Utilities and features 77
- Keeping the system current 78
- Software and firmware 79
- Version control 79
- ProLiant servers 79
- Troubleshooting 81
- System battery 82
- System battery 83 83
- Regulatory information 84
- Warranty information 85
- Electrostatic discharge 86
- Specifications 87
- Support and other resources 88
- Customer Self Repair 90
- Reparo feito pelo cliente 92
- Acronyms and abbreviations 96
- Version Control Agent 99
- Virtual Machine 99
- Documentation feedback 100
- Index 101 101
- Index 102 102
- Index 103 103
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