Hp ProLiant ML370 G5 Server Manual de usuario Pagina 42
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Hardware options installation 42
NOTE: The appearance of compatible PPMs may vary.
16. Install the processor air baffle.
17. Install the access panel (on page 26).
18. Do one of the following:
o Close or install the tower bezel, as needed.
o Slide the server back into the rack.
19. Power up the server (on page 20).
Memory options
This server supports two memory boards. Each memory board contains 8 DIMM slots for a total of 16
DIMM slots in the server. You can expand server memory by installing supported DDR-2 FBDIMMs.
Memory configurations
The server supports the following Advanced Memory Protection (AMP) options to optimize server
availability.
• Advanced ECC supporting up to 32 GB of active memory using 2-GB FBDIMMs.
• Online Spare Memory providing additional protection against degrading FBDIMMs supporting up to
28 GB of active memory and 4 GB of online spare memory utilizing 2-GB FBDIMMs.
• Mirrored Memory providing protection against failed FBDIMMs supporting up to 16 GB of active
memory and 16 GB of mirrored memory utilizing 2-GB FBDIMMs.
Maximum memory capacities for all AMP modes will increase with the availability of 4-GB and 8-GB
FBDIMMs, including a maximum of 64 GB in Advanced ECC mode. For the latest memory configuration
information, refer to the QuickSpecs on the HP website (http://www.hp.com
).
- User Guide 1
- Audience assumptions 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Item Description Status 9
- Systems Insight Display LEDs 10
- Rear panel components 11
- Rear panel LEDs 12
- System board components 13
- System maintenance switch 14
- SAS and SATA device numbers 15
- SAS and SATA hard drive LEDs 16
- Online/activity 17
- LED (green) 17
- Fault/UID LED 17
- (amber/blue) 17
- Interpretation 17
- FBDIMM slots 18
- Power supply backplane LED 19
- Fan locations 19
- Operations 20
- Operations 21 21
- Operations 22 22
- Remove the rack bezel 23
- Operations 24 24
- Install the rack bezel 25
- Remove the access panel 25
- Install the access panel 26
- Remove the center wall 27
- Rack planning resources 28
- Optimum environment 29
- Temperature requirements 30
- Power requirements 30
- Rack warnings 31
- Server warnings and cautions 31
- Setup 32 32
- Installing hardware options 33
- Setting up a tower server 33
- Setup 34 34
- Registering the server 35
- Introduction 36
- Processor option 36
- 13. Install the heatsink 41
- 15. Install the PPM 41
- Memory options 42
- Advanced ECC memory 43
- Online spare memory 44
- Mirrored memory 45
- Memory boards and FBDIMMs 46
- Removing FBDIMMs 48
- Installing FBDIMMs 49
- Hot-plug hard drive options 50
- Remove the hard drive blank 51
- Prepare the hard drive 51
- Expansion board options 61
- Performance balancing 62
- Expansion slot cover 62
- Installing expansion boards 63
- Removing expansion boards 64
- • Rack rails 67
- • Cable management arm 67
- • Server rails 67
- • Rack bezel 67
- Remove the CD-ROM drive 69
- Install the center wall 74
- Cabling 75
- SAS cabling 76
- CD-ROM drive cabling 77
- Video cabling 78
- Parallel/serial port cabling 78
- Diskette drive cabling 79
- BBWC option cabling 79
- Internal USB connector 80
- Configuration and utilities 81
- HP ROM-Based Setup Utility 82
- Boot options 83
- BIOS Serial Console 83
- Configuring mirrored memory 83
- Array Configuration Utility 84
- Auto-configuration process 84
- Management tools 86
- Management Agents 88
- HP Systems Insight Manager 88
- Redundant ROM support 88
- USB support 89
- Diagnostic tools 90
- Integrated Management Log 91
- Keeping the system current 92
- Care Pack 93
- Battery replacement 94
- Battery replacement 95 95
- Troubleshooting 96
- Symbols on equipment 97
- Warnings and cautions 97
- Symptom information 98
- Loose connections 99
- Service notifications 100
- Troubleshooting flowcharts 100
- General diagnosis flowchart 101
- Symptoms: 103
- Troubleshooting 105 105
- POST problems flowchart 106
- OS boot problems flowchart 107
- • Redundancy failure 110
- Troubleshooting 111 111
- Electrostatic discharge 112
- FCC rating label 113
- Class A equipment 113
- Class B equipment 113
- Modifications 114
- • EMC Directive 2004/108/EC 115
- Japanese notice 116
- BSMI notice 116
- Korean notice 117
- Laser compliance 117
- Battery replacement notice 117
- Specifications 119
- Specification Value 120
- Technical support 121
- Customer Self Repair 122
- Technical support 124 124
- Reparo feito pelo cliente 126
- Technical support 127 127
- Technical support 128 128
- Acronyms and abbreviations 129
- Index 132 132
- Index 133 133
- Index 134 134
- Index 135 135
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